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Intel SoC Design Verification Engineer in Malaysia

Job Description

As a member of the Logic Design and Validation group within the Lead Vehicle Development group in Design Enablement you will be part of a team that develops the RTL models and pre-silicon validation tests for test chips on the next generation Intel silicon manufacturing process. Your responsibilities would include:

  • Creating new digital, analog, and mixed-signal RTL models for new and existing designs

  • Running the Functional Equivalence Verification (FEV) flow to compare RTL to schematics

  • Owning the creation of pre-silicon validation test plans, formal SystemVerilog/UVM testbenches, and validation test cases

  • Owning RTL design of new digital systems ranging from design-for-test (DFT) on existing systems to novel designs to enable Power-Performance-Area (PPA) studies on next-generation technology nodes.

The ideal candidate should exhibit the following behavioral traits:

  • Motivated, driven, with sense of urgency and commitment to achieve targeted goals

  • Communication and problem-solving skills

  • Documentation, and presentation skills

  • Troubleshooting and analytical skills

#DesignEnablement

Qualifications

Minimum Requirements

Candidate must possess a Master's degree in Electrical Engineering, Computer Engineering, or related fields of study with experience listed below or a Bachelor's degree in Electrical Engineering, Computer Engineering, or related field with a minimum of 2 years of experience in the following:

  • Digital design using Verilog and System Verilog

  • Performing Pre-Silicon Logic Validation at Unit level or Integration level

  • Experience with OVM/UVM test benches and verification concepts

  • Object Oriented Programing (OOP) in any programing language, preferably in SystemVerilog

  • SystemVerilog Assertions (SVA), their creation and application in closing validation coverage

  • Coverage-based verification and how to leverage for efficient validation closure

Preferred Requirements

  • Experience with analog circuits and their interaction with digital systems

  • Experience in the Unified Power Format (UPF) specification

  • Experience with scripting and automation with languages such as Perl or Python

#designenablement

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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