Qualcomm PDN Signoff Engineer in India
Company:Qualcomm India Private Limited
Job Area:Engineering Group, Engineering Group > Hardware Engineering
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.
Minimum years of experience : 6 to 10 Yrs Job Description : IR Signoff for High Performance DSP Cores. Signal EM & Power EM Signoff for High Performance DSP Cores. Development of PG Grid spec for different DSP cores. ESD Signoff for High Performance DSP Cores. Validating the PG Grid using Grid Resistance & Secondary PG Resistance Checks Validating the IR Drops using Static IR , Dynamic IR Vless & VCD Checks for validating Die & Pkg Components of IR Drops. Working with SOC and Packaging Teams on Bumps Assignments / RDL Enablement / Pkg Routing Optimizations to improve overall PDN Design. Good knowledge on PD would be helpful. Perl , TCL Scripting Skills.Skill Set : Hands – on experience in PDN Signoff using Redhawk / RHSC / Voltus at block level / SOC Level. Good understanding on Power Integrity Signoff Checks. Proficient in scripting languages (Tcl and Perl). Familiarity with Innovus for RDL / Bump Planning. Ability to communicate effectively with multiple global cross-functional teams
Bachelors - Computer Science, Bachelors - Engineering, Bachelors - Information Systems
4+ years Hardware Engineering experience or related work experience.
6+ years Hardware Engineering experience or related work experience. ,1+ years in a technical leadership role with or without direct reports. ,2+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc. ,2+ years experience utilizing schematic capture and circuit simulation software. ,2+ years experience with circuit design (e.g., digital, analog, RF).
Computer Science, DSP Architectures, Electrical Engineering, Optical Systems, Packaging Systems
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