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Micross Advanced Interconnect Technology (MAIT) is seeking an experienced Sales person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines at its Research Triangle Park, NC facility. This position will serve primarily as an outward facing Sales person identifying and developing opportunities with existing and potential clients in support of the Inside Sales/Business Development Team and with assistance from the Micross Components’ Group Sales Team. Exceptional candidates will have a strong technical background and experience in technical sales in the semiconductor packaging industry with a proven track record of independently seeking out and developing new business opportunities.

Requirements

Essential Duties & Responsibilities:

• Championing MAIT’s capabilities through the national Micross Components’ Group Sales team and closing on specific opportunities

• Interacting with customers to develop defined statements of work and specifications to meet customer deliverables

• Working knowledge of Wafer Level Packaging process flows and develop understanding of Micross AIT’s 3DHI process flows and capabilities

• Interfacing with other functional departments within MAIT to assist with Sales and Quoting activities.

• Ability to manage multiple customer inquiries and quoting deliverables in a fast pace environment

Other Duties & Responsibilities:

• Communicate customer meeting and program details and project status to Micross sales team and MAIT management

• Assist in developing short term and long term business strategy initiatives

• Help with the development of pricing and service terms to meet business growth and EBITDA targets

• Comply with all quality (AS9100 D) and ITAR policies, practices and procedures

• Build meaningful and productive relationships with internal business partners and customers

• Participate in proactive team efforts to achieve departmental and company goals

• Communicate effectively with all levels of employees

• Protect confidential information by not communicating, disclosing to, or using for benefit of 3rd parties

• Maintain the highest degree of honesty and integrity at all times

• Perform other duties as assigned

Job Qualifications:

• Hands-on business development/sales experience in a semiconductor packaging or related field, with WLP experience a plus

• Experience directly interfacing with customers in sales responsibilities for both short and long term technical projects

• Prior experience in helping launch a product or service from a “research” level into a specialty commercial venture

• Prior experience in the Hi-Rel packaging sector with exposure to Space and Mil-Aero customers preferred

• At least a Bachelor’s degree, or higher, in Engineering or Science

• Due to export control rules, must be a US citizen, or US permanent resident.

• Willingness and ability to learn new skills and new software. This position will require heavy use of the computer and may interface with design software and work-in-progress and manufacturing execution software.

Job Skills:

• Excellent verbal and written communication skills are a must. This position will interface with external customers as well as all levels of internal business partners.

• Attention to detail is a must because this position will require the need to create and follow procedures surrounding ITAR regulations and QA systems.