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Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research.​

We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins.

Job Description

Teledyne Microwave Solutions has over 50 years of experience in the design, development, and manufacture of sophisticated microwave/RF components and integrated assemblies for the most demanding challenges. Our products and capabilities are sought after by civilian and military organizations spanning numerous global markets, including Aviation, Communication, Electronic Warfare (EW/ECM/CIED), Industrial, Missile/UAV, Radar, Satcom, Space, and Test and Measurement. Teledyne Microwave Solutions invests heavily in research and development to maintain the ability to offer the world’s most advanced MW/RF capabilities for current and emerging challenges.

Position Summary

We are seeking a Process Development Engineer to join our team! This position provides process engineering support for thin-film hybrid assembly. Develops and implements optimal, cost-effective manufacturing processes and methods in accordance with product specifications and quality standards; recommends and implements improvements to production processes, methods and controls; coordinates manufacturing launch for new or revised products.

Primary responsibilities include:

• Support MIC Assembly processes, including eutectic attach, epoxy attach, bond pull, gap welding, seal, and paint.

• Support MIL-PRF-38534 QML tests (PIND, RGA, Group B, and C, etc.). Troubleshoot new assembly processes and analyzes data. Perform resolution of in-process technical issues and assure that a root cause and effective corrective action is implemented.

• Participates in process development and related research. Generate ECOs to correct and improve assembly documentation. Develop, sustain, and improves manufacturing methods to improve efficiency and yield.

• Assists in new product development with emphasis in auto wire-bonding and auto die attach.

• Lead the transfer of processes, process improvements, and products from NPI to production.

• Utilizing CAD software, designs and makes recommendations for tooling, packaging, and process requirements for new or existing product lines.

• Trends and analyzes production data. Develops solutions to process related issues utilizing appropriate tools (Lean, PFMEA, SPC).

• Facilitates engineering changes and manages their full implementation internally.

• Formulate product and tooling design concepts, following up with cost effective, functional designs, utilizing a DFM approach. Create and provide all necessary drawings and assembly instructions.

• Provides Process Engineering support for thin-film hybrid assembly.

• Participates in company mandated certification such as ISO 9001, AS9100, MIL-PRF-38534.

• Research and development of new processes. Evaluate materials for appropriate and innovative process choice.

• Design and improve existing processes. General capital investment analysis, resulting in justification and/or best decision whether to proceed with capital investment (e.g. BEP, depreciation). ROI analysis.

Qualifications

• Bachelor’s degree or equivalent with a minimum of one years experience as a Manufacturing or Process Engineer in electronics manufacturing, including assembly and test or related filed.

• Preferred background in electronics assembly (wire bonding, die/component attach) and processes.

• Preferred knowledge and experience with process tooling design and application.

• Understanding of analyzing manufacturing / support processes and driving continuous improvement.

• Demonstrated ability to proactively identify opportunities to improve performance, develop targets and action plans and lead an organization to achieve results.

• Excels at yield analysis and failure analysis leading to root cause and effective corrective actions.

• Demonstrated ability to efficiently and effectively monitor operations with excellent communication (verbal and written) and presentation skills.

• Communicate clearly with excellent speaking, writing, and presentation skills. Ability to organize and meet project goals and deadlines.

• Working knowledge AS9100/ISO9001 standards (or equivalent).

• Proficient in use of standard Microsoft Office products in producing data-driven reports

• Knowledge of SolidWorks (or equivalent modeling/simulation software).

• US Citizenship with ability to attain/maintain Security Clearance

Salary Range:

$71,940.00-$96,140.000

Pay Transparency

The anticipated salary range listed for this role is only an estimate. Actual compensation for successful candidates is carefully determined based on several factors including, but not limited to, location, education/training, work experience, key skills, and type of position.

Teledyne and all of our employees are committed to conducting business with the highest ethical standards. We require all employees to comply with all applicable laws, regulations, rules and regulatory orders. Our reputation for honesty, integrity and high ethics is as important to us as our reputation for making innovative sensing solutions.

Teledyne is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability or veteran status, age, or any other characteristic or non-merit based factor made unlawful by federal, state, or local laws. ​

You may not realize it, but Teledyne enables many of the products and services you use every day .

Teledyne provides enabling technologies to sense, transmit and analyze information for industrial growth markets, including aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, energy, medical imaging and pharmaceutical research.