Experience Inc. Jobs

Company:

Qualcomm Semiconductor Limited

Job Area:

Engineering Group, Engineering Group > Packaging Engineering

Qualcomm Overview:

Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in.

General Summary:

【Job Overview】

This position is part of Qualcomm’s Integrated Circuits (IC) package engineering process team. This role offers unique opportunity to impact Qualcomm's current/future chipsets using FEA expertise, working closely with design, new product introduction (NPI) and Chip-Package Interaction (CPI) teams by providing mechanical simulation support for current HVM and advanced packaging technologies. This role requires development of mechanical FEA models (preferably using ANSYS APDL and Workbench), maintain APDL macros/workflows, establish FEA methodologies/BKM for test correlation, material characterization, and performing stress/mechanical analysis for IC package designs and failure prediction. Job responsibilities include but not limited to: Warpage/Stress analysis, Solder joint reliability (SJR) prediction, package assembly process simulation, and chip package interaction (CPI) analysis. The candidate must be capable of utilizing advanced Finite Element Analysis (FEA) techniques (sub-modeling approach, contact analysis, non-linear analysis), and test procedures for material characterization/testing. Candidate should also understand the fundamentals of silicon, package, and board level interconnect technologies. The candidate is expected to have strong communications, project focus and execution skills.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

【Minimum Qualifications】

· Master’s degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related engineering field.

· 3+ years of work experience in mechanical FEA analysis for

Semiconductor and IC microelectronic packaging industry.

· 2+ years of experience in ANSYS (APDL/Workbench).

【Preferred Qualifications】

· Ph. D degree in Mechanical engineering, Material science, Electrical/Microelectronics, or related engineering field.

· 5+ years of combined experience in Finite Element modeling and Analysis for IC electronic package and interconnects.

· 2+ years of experience in ANSYS (APDL/Workbench).

· 3+ years of work experience in Semiconductor and IC microelectronic packaging industry. Experience with the fundamentals of IC electronic packaging structures, assembly processes, reliability testing and analysis, CPI, Package-Board interaction, and design of experiments (DOE).

· Solid understanding of IC packaging materials and their thermo-mechanical behaviors.

· FEA experience with FCBGA packages (bare-die vs lidded), thermo-mechanical behavior/interaction of TIM/Lid/adhesive and its predictions are preferred.

· Hands on FEA experience in Automotive/Datacenter SoC package applications or SiP/Module applications (plus).

· Research and publications in FEA predictive modeling, Warpage, CPI, and Solder lifetime prediction (plus).

· Good analytical and project execution skills.

· Excellent communications and presentation skills.

· Self-starter, highly motivated and committed to product success.

【Educational Requirements】

Master’s degree in mechanical engineering, Material science, Electrical/Microelectronics, or related engineering field.

Applicants : If you need an accommodation, during the application/hiring process, you may request an accommodation by sending email to accommodationsupport

Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law.

To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications.

If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification