Intel Principal Engineer, Advanced Packaging in Hillsboro, Oregon
About Assembly Test Technology Development (ATTD):
Technology Development (TD) is the heart and soul of Moore’s Law at Intel. TD has enabled Intel to create world-changing technology that enriches the lives of every person on earth. TD’s more than 10,000 employees drive breakthrough research, develop next generation process and packaging technologies, while also running high volume manufacturing operations in its state-of-the-art facilities in Oregon and Arizona.
Within TD, ATTD designs and delivers packaging and test solutions for Intel products and foundry customers that enable world-class technologies leveraging an increasing heterogenous chip architecture.
About the Role:
We're looking for a motivated, passionate, and talented Principal Engineer to join the Wafer Assembly Technology Development (WATD) to realize Intel's IDM 2.0 vision with advanced packaging technologies.
As a principal engineer, you are recognized as a domain expert who influences and drives technical direction across Intel and the industry. Develops and mentors other technical leaders, grows the community, acts as a change agent, and role models Intel values. Aligns organizational goals with technical vision, formulates technical strategy to deliver leadership solutions, and demonstrates a track record of relentless execution in bringing products and technologies to market.
The Principle Engineer in WATD, has the following responsibilities:
Drives technology development and enablement for both high volume manufacturing and future technology, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
Leads design and development of technically sophisticated manufacturing processes and/or repair reverse engineering including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Performs pathfinding activities in support of process and hardware development enabling manufacturing of innovative device architectures, and develops roadmaps for technologies enabling future roadmap.
Recommends and implements modifications for operating equipment to improve production efficiency, manufacturing techniques, and optimizing production output for existing products.
Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
Performs process technology feasibility studies through theoretical simulations and/or practical engineering methods.
Remains updated on relevant industrial process and material manufacturing technical trends and develops view of inherent future Intel process technology needs to push industry forward by partnering with vendor ecosystem to build cost sensitive roadmap.
PhD OR Masters degree in Electrical Engineering, Chemical Engineering, Material Science, Physics or Chemistry with over 10 years of experience in the semiconductor industry
Experience in advanced packaging technology development.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here. (https://jobs.intel.com/en/benefits)
This role will require an on-site presence.
Position of Trust
This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter.
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