Intel Defect Reduction Engineer in Hillsboro, Oregon
Assembly and Test Technology Development (ATTD) is looking for a Defect Reduction Engineer to join the Yield team. Candidate must be able to:
-Develop solutions to problems utilizing formal education statistical knowledge and problem solving tools.
-Demonstrated ability to influence stakeholders and formulate databased recommendations directed at defect reduction and yield improvement.
-Should have high tolerance to ambiguity and be effective in a fast pace working environment.
- Demonstrated analysis of large and diverse data sets apply statistical methods and draw meaningful conclusions to help direct the efforts of the organization.
The Defect Reduction Engineer responsibilities are but not limited to:
-Closely monitor the Visual Mechanical Defect Yield Baseline Manage yield excursion and drive permanent fixes with responsible teams.
Defining the defect reduction roadmap and driving the yield improvements with partner teams that include not limited to Integration Materials Manufacturing and Assembly and/or Test Modules.
Will focus on internal development and manufacturing activities as well as engage with ATM counterparts to help define and drive their yield roadmap during transfer.
The ideal candidate should exhibit the following behavioral traits or and skills:
Problem solving by applying formal problem solving methodologies and troubleshooting abilities.
Analytical problem solving written and oral communication.
Teamwork and partnership.
Tolerance of ambiguity self-motivation
Some domestic and International travel is required ( 5%-10% per year).
This is an entry level position and compensation will be given accordingly.
You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences .
- Candidate must possess a master’s degree (with 6+ months of experience) or PhD in Materials Science and Engineering or Mechanical Engineering or Chemical Engineering or Electrical Engineering or Chemistry or Physics or similar field.
Must have the required degree or expect the required degree by September 2021.
1+ years of experience in the following:
Low Yield Analysis techniques, material characterization, micro contamination and foreign material reduction activities.
Data analysis software such as JMP and data mining tools such as SQL and PF.
Packaging Assembly and test process or other semiconductor processes
Data visualization including scripting and automation of standardized analyses and reports.
LYA material characterization, micro contamination and FM reduction activities.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
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