Job Information
Broadcom FBAR Integration Engineer in Fort Collins, Colorado
Please Note: 1. If you are a first time user, please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description:
FBAR Process Integration Engineer As an Integration Engineer with the Wireless Semiconductor Division (WSD) of Broadcom Inc., you will support high volume manufacture of (Film Bulk Acoustic Resonator) piezoelectric MEMs process technologies. This highly motivated individual will apply their technical expertise to maximizing yields, performance and quality on new and existing filter products while balancing cost and production efficiency. Integration team members work closely with process and equipment engineers, FBAR process R&D, product development, and quality teams to ensure that all products and technologies are produced in a robust manufacturing environment.
Primary Objectives and Responsibilities:
Work with peers and cross functional partners in manufacturing, development, quality and new product introduction to improve and stabilize new and existing processes with respect to safety, quality, yield, reliability, productivity, cycle time, and cost reduction. Characterize and document improvements.
Identify, create and maintain process controls and metrics for critical and key electrical and physical parameters.
Take ownership of newly MR'd processes to address and complete any outstanding issues and drive continuous improvement in metrics.
Work with peers and the Manufacturing Engineering Manager to establish project objectives, schedules and resource profiles for projects. Organizes and manages projects to meet agreed goals.
Address issues and/or coordinate basic analysis and improvement of parametric and fab metrics. Find root cause and drive resolution.
Work with QA, local reliability resources, unit process owners, and product engineers to track, plan, and/or coordinate process change qualifications and respond to any yield, quality, and reliability issues that m
Develop and maintain control plans and FMEA's for processes.
Champion integration investigations. Determines root cause and drive resolution of integrated related scrap events.
Partner with manufacturing engineering to establish qualification plans for process changes.
Early participation in R&D process development to assist limited R&D resources and capture defectivity issues and manufacturability concerns.
Know the FBAR process flows in depth, including ownership and understanding of design rules.
Responsible for all NPI introduction into the fab, from mask review, process flow setup, design rule validation, and implementing design values.
Close partnership with NPI teams regarding new technology intersection.
Develop technology variants to reduce cost and improve manufacturability
Technical Experience
BS (MS or higher preferred) in Physics, EE, ME, ChE, Materials Science or related engineering discipline.
Five or more years of experience in wafer process technology development and/or manufacturing.
A history of identifying process improvement opportunities, developing plans with appropriate cost/quality/reliability tradeoffs, and successfully implementing.
Understanding of wafer fabrication processes (photolithography, dry/wet etch, CMP, CVD/PVD), process interactions and their impact on the final product
A track record of meeting aggressive schedules with breakthrough performance.
Demonstrated leadership of cross-functional teams meeting requirements on schedule.
Strong analytical skills in DOE, data analysis, SPC, FMEA and related tools, and a history of using them with a disciplined, logical, data-driven approach.
Experience with failure analysis methods (including FIB/SEM) and understanding of basic device failure mechanisms.
Strong initiative
Excellent teamwork, good verbal and written communi ation skills.
Demonstrates clear and concise written and oral communication. Documents work. Proactively communicates to peers, cross-functional, and global teams.
Helpful to have basic understanding of RF principles and applications and