II-VI Inc. Polishing Technician in Easton, Pennsylvania
Easton, PA, USA
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KEY JOB DUTIES & RESPONSIBILITIES:
Basic Job Functions:
The successful applicant will work with a R&D Team with focus on projects and specific tasks related to the development of wide bandgap semiconductor single crystals and substrates. Will focus on the fabrication of semiconductor substrates including technological tasks of crystal boule orientation, slicing, grinding, wafer polishing, CMP, cleaning and inspection. Will work under the guidance of the Team engineers and will closely follow the engineering guidelines and written technological procedures. Will perform measurements using a variety of metrology tools, followed by documenting the results and database entry. When requested, will participate in equipment maintenance and repair. Will maintain order and cleanliness in the work areas.
- Associate Degree in engineering/science OR High School Diploma with 3 years experiences in substrate slicing, fabrication or polishing is a minimum requirement. Bachelor's degree in an engineering or science discipline is preferred.
Hands-on experience in a technical field. A one-year or more work in a technical field is a plus.
Exposure to a technological process, equipment maintenance, measurements and data collection are plusses.
Computer literate. Experience with Microsoft Word, Excel, Outlook, PowerPoint, Email, and Internet.
Must be technically inclined with good mechanical skills.
Must be well organized and able to perform several tasks in parallel.
Must be computer-literate to operate computer-controlled equipment and perform data entry.
Will demonstrate and promote the II-VI I-CARE values:
Must be prepared to work flexible hours, evenings, and weekends as a part of normal work schedule.
ITAR compliance requirement: Individual must be a U.S. Citizen, Permanent Resident Alien, or Protected Individual per 8 U.S.C. 1324b(a)(3).
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