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II-VI Inc. Lead R&D CMP Engineer in Easton, Pennsylvania

Lead R&D CMP Engineer

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  • Easton, PA, USA

  • Full Time

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Basic Job Functions:

Works as Principal Investigator on tasks related to the development of cutting-edge technology of Silicon Carbide (SiC) substrate fabrication and polishing. Carries primary responsibility for the development of SiC substrate polishing. Takes a leading role in the characterization of the surface quality of the SiC substrates using all necessary tools and techniques.

Investigates and models experimental data related to SiC substrate fabrication and polishing to establish correlations and trends. Finds innovative solutions to technical problems leading to improved product quality, yields, and throughput. Focuses on achieving high reliability of the equipment and processes used in SiC substrate fabrication and polishing. Actively participates in the equipment upgrades.

Contributes to the generation of scientific concepts and milestones for R&D programs. Participates in proposal writing. Writes sections for technical reports, as assigned by General and Program Managers.

Generates scientific and technical ideas and contributes to the Intellectual Property of II-VI by writing IP disclosures and patent applications.


  • MS or Ph.D. in Mechanical Engineering, Materials Science, Chemistry or related discipline.


  • 5-8 years in high volume crystal fabrication and polishing, preferably, in semiconductor substrate fabrication and polishing

  • Experience in polishing of GaAs, InP, Si, SiC, or other semiconductor materials is preferred

  • Extensive hands-on experience in semiconductor materials and technological process used in semiconductor substrate manufacturing

  • Demonstrated ability to lead people and achieve results through others

  • Experience with problem analysis and resolution

  • Proven track record of continuous improvement

  • Experience in proposal/report writing and presentations in an environment of contract R&D

  • Experience in process characterization and optimization

  • Excellent interpersonal and communication skills

  • Able to develop plans, set goals, to evaluate work accomplishments, and provide effective feedback

  • Experienced with Statistical tools and analysis

    Special Skills:

  • Knowledge and experience with the processes and equipment used in polishing of semiconductor crystals, including CMP polishing

  • General knowledge and hands-on experience in procurement, installation, operation and maintenance of fabrication and polishing equipment

  • Strong mechanical aptitude and problem-solving capability

  • Hands-on with computerized design tools, such as Pro-Engineer or similar

  • Demonstrated knowledge of process development tools, such as SPC and DOE

  • Ability to work with customers/vendors

  • Ability to handle multiple priorities and issues in a fast-paced, dynamic environment

  • Ability to work with employees in a multi-cultural, global team environment

  • High standards of ethics, professionalism, leadership, and competency

    Will demonstrate and promote the II-VI I-CARE values:

  • Integrity

  • Collaboration

  • Accountability

  • Respect

  • Enthusiasm

  • Must be prepared to work flexible hours, evenings, and weekends as a part of a normal work schedule.

    ITAR compliance requirement: Individual must be a U.S. Citizen, Permanent Resident Alien, or Protected Individual per 8 U.S.C. 1324b(a)(3).

    II-VI is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.