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Position Description : Substrate Advanced Packaging Modelling emphasis on thermo-mechanical modelling

Summary :

• Develop thermo-mechanical modeling for advanced packaging technology with background knowledge of substrate and assembly technologies

• Travel to Georgia and Korea will be required in this role

• Required to relocate to Georgia by Jan 1, 2024

Responsibilities:

1. Work with cross functional teams to define advanced package thermal/ mechanical specifications by carrying out package/system thermal modeling. This role is focused on advanced packaging technologies and effective simulation and modeling to help choose the right direction are core responsibilities

2. Develop electrical models so that materials and build choices can be compared to electrical performance

3. Through modeling identify key areas to focus performance and reliability efforts to meet product specifications. Working closely with the core technology team to have a good understanding of the boundaries for equipment capability is critical

4. Work with Manufacturing team to validate models and establish impact on product yield and reliability

5. Using modeling, support the transition from R&D to small or high-volume manufacturing (S/HVM) by working with a cross-functional team to benchmark impact of changes in process flow

6. Using simulations and modeling to re-direct individual unit processes or an integrated process flow are important deliverables in this role

Education: M.S. or Ph.D. in an Engineering discipline

Experience: 5 to 7 years in the Semiconductor Packaging Industry

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Qualifications

Education:

Bachelor's Degree

Skills

Certifications:

Languages:

Years of Experience:

7 - 10 Years

Work Experience:

Additional Information

Travel:

Yes, 50% of the Time

Relocation Eligible:

No

U.S. Salary Range:

$120,000.00 - $165,000.00

The salary offered to a selected candidate will be based on a number of factors including location and level and will vary depending on confirmed job-related knowledge, skills, and experience. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

Applied Materials is an Equal Opportunity Employer committed to diversity in the workplace. All qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations Make Possible a Better Future.