Fortive Corporation Senior Advanced Packaging Manufacturing Engineer in Beaverton, Oregon
We believe that cultivating a deeper sense of loyalty and belonging is key to how we attract and retain our best people. By embracing our diverse experiences and views, we are better positioned to deliver results, create innovations that matter, and thrive in today’s changing world. This reality inspires our Inclusion & Diversity vision, We Are More Together, and guides our approach as we all work toward creating great places where our teams work and thrive.
We are looking for a Senior Process Engineer who will be responsible to drive development of innovative packaging technologies for Tektronix Component Solutions’ advanced 2.5D/3D devices. The successful candidate will work in collaboration with external wafer foundries to develop back-end processes, and develop assembly processes for advanced CMOS nodes, stacked die assemblies, interposer technologies and other emerging packaging technologies for highly integrated multi-chip module products with silicon and III-V compound semiconductors. They will have experience with Thermo-compression bonding, fcCSP, copper pillar, and eutectic attach. They will be responsible for defining package design rules and assembly rules to meet manufacturability and yield requirements. They will work in a cross-functional team to ensure developed processes maintain high yield in a high-compliance manufacturing environment, including quality and reliability industry standards for military applications.
Apply extensive knowledge and experience in developing assembly processes for advanced packaging applications
Create programs and profiles on various equipment for die placement, material dispense, pressure cure, etc.
Use statistical process controls to monitor and improve processes
Define material selection for underfill
Work within a multi-discipline team to solve complex assembly challenges
Lead a team of cross-functional specialists in technical problem-solving exercises
Advanced degree (Master's or PhD) in mechanical engineering, material science, or related field.
7+ years of experience in the design, qualification, and production deployment of assembly processes for advanced packaging applications in high compliance environments with long term reliability
Experience working in a lean manufacturing environment
Proficient with automated die placement equipment for tight-pitch flip chip applications
Proficient with epoxy dispense systems for electrically conductive epoxy, underfill applications, and thermal interface materials.
Experience with advanced CMOS nodes, ultra-low k dielectrics, III-V materials, and stacked die assemblies.
Experience with various substrate materials.
When you join Tektronix and Fortive, you will work in an extraordinary team, learning with and from great people, where diversity and inclusion is celebrated. You will have the opportunity to do work that makes a difference in the world. You will be trusted and empowered to contribute in meaningful ways with visibility and accountability. We are obsessed with our customers and have a commitment to transparency, unending learning and growth to accelerate progress and innovation. Join us for the excitement of a startup with a history of success! For You. For Us. For Growth.
This position's primary/essential functions are subject to US Government ITAR compliance requirements under current government contracts. Therefore, all applicants must be either a US Citizen or a holder of a current valid Green Card and must provide proof of citizenship or legal residency via a birth certificate, a current valid green card, unexpired passport, or a naturalization certificate. We encourage applicants to bring such proof to their interview. However, in no case will applicants be allowed to begin their scope of work in this specific position without providing such proof.
All employment offers are contingent upon successful completion of our pre-employment drug screening, background/criminal check, and if applicable a motor vehicle record search and/or financial record check.
Candidates with less education/experience may be considered for other opportunities.
Fortive is a diversified industrial growth company comprised of global businesses that are recognized leaders in attractive markets. With more than $6 billion in annual revenues, Fortive’s well-known brands hold leading positions in field instrumentation, transportation, sensing, product realization, automation and specialty, and franchise distribution.
Fortive is headquartered in Everett, Washington and employs a team of more than 24,000 research and development, manufacturing, sales, distribution, service and administrative employees in more than 40 countries around the world. Our team grows by tackling challenges that accelerate progress and further their careers. With a culture rooted in continuous improvement, the core of our company’s operating model is the Fortive Business System. For more information please visit: www.fortive.com.
Tektronix is a place where people are challenged to explore the boundaries of what’s possible, bringing the digital future one step closer every day. Our work accelerates technological breakthroughs that are revolutionizing culture and industry worldwide. Through precision-engineered measurement solutions, we work with our customers to eliminate the barriers between inspiration and realization of world-changing technologies. Realize your true potential at Tektronix – join us in revolutioneering a better tomorrow.
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