Experience Inc. Jobs

Company Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

Job Description

ESSENTIAL DUTIES AND RESPONSIBILITIES:

• Key Technical Integration role to drive and enable product, silicon, process and materials technology roadmap solutions for next generation memory storage packaging solutions

• To co-drive / engage in advanced packaging conceptual to productization activities with global cross-functional teams including silicon design, product design, fab back-end, process engineering and test engineering.

• Lead yield integration and detailed analysis activities in wafer level processing characterization and qualification phases. Be the primary driver in wafer level to assembly to final product test investigation and correlation activities.

• To engage in collaboration with suppliers, 3rd party service providers, academia, industry consortium in establishing new industry standards

• To lead studies related to in-depth fundamental investigation / characterization in packaging development ensuring strong materials to process / design compatibility to meet stringent quality and reliability requirements from customers and industry standards

• To drive in-depth fundamental engineering investigation culture and problem-solving methodology in delivering robust packaging technology

• To coordinate industry benchmarking, competitive analysis.

• To drive technology roadmap definition and pathfinding / development programs with global cross-functional teams including product design, process engineering, lab characterization teams and test engineering in delivering Best-In-Class and Industry leading products

Qualifications

Required:

• Minimum 8 years of Semiconductor Packaging Process with in-depth exposure to wafer RDL process, wafer bumping process, Wafer level fan-in/fan-out and/or TSV wafer processing technology in wafer fab backend, or high-density advanced packaging architecture will be desired.

• Strong engagement in Fab Backend or Packaging technology development experience and well-versed with R&D methodology.

• Strong experience in driving technology roadmap and technology innovation to achieve best-in-class advanced packaging technology solutions.

• Proven experience with in-depth engagement in silicon design rule, materials and process technology fundamentals.

• Proven experience with in-depth engagement in materials and process technology fundamentals, with materials characterization lab either internally, suppliers or other 3rd party.

• Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies.

• Ability to lead complex technical investigation and analysis with global cross-functional teams.

• Proven capabilities to navigate through highly dynamic and fast-paced project requirements and interdependencies.

• Strong hands-on experience Packaging technology development experience and well-versed with structured R&D methodology.

• Master’s degree or PhD in Materials Engineering / Mechanical Engineering / Physics / Micro-electronics.

Preferred:

• Ability to drive external CM / OSATs / suppliers on process qualification and co-development.

• Practical experience in application of AI / ML-augmented engineering development and innovation and analytics.

• Personal hands-on experience on advanced lab instruments e.g. SEM/FIB, EDX/FTIR, Shadow Moire, will be added advantage.

Additional Information

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com (staffingsupport@wdc.com) to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

NOTICE TO CANDIDATES: Sandisk has received reports of scams where a payment is requested on Sandisk’s behalf as a condition for receiving an offer of employment. Please be aware that Sandisk and its subsidiaries will never request payment as a condition for applying for a position or receiving an offer of employment. Should you encounter any such requests, please report it immediately to Sandisk Ethics Helpline (https://secure.ethicspoint.com/domain/media/en/gui/95737/index.html) or email compliance@sandisk.com.